1 to 30 Layer’s Rigid PCB’s   1 to 10 Layer Flexible PCB’s   Multilayer Rigid-Flexible PCB’s   Aluminum backing PCB’s   24 hr to 5 days delivery on prototypes   5 days to 4 weeks delivery on production   Copper thickness from ½ oz to 5 oz (max)   Printed Circuit board thickness from 0.020”   to 0.125”   Minimum line width .003”

Minimum spacing .003”   Min SMT pitch .005”   Minimum hole size .006”   Laser Hole .002”   Controlled Impedance   Hole to hole location +/- .001”   Pad to pad annular ring (solder mask) per   IPC spec   Hole to pad annular ring (circuitry) per   IPC spec   NC routed dimension +/- .005”   NC scored dimension +/- .010”

 The above capabilities are for general manufacturing purposes. Whenever possible IPC Class 2 standard specifications apply.

 

Materials:  FR4, High TG FR4, RoHS FR4, CEM, Teflon, Aluminum Base, Polyimide, Ceramic Material Manufacturers:  Kingboard, Nanya, Isola, Rogers, Arlon, Taconic, Metclad… Photo-plotting LPI technology Screen coat/ Imaging system for accurate mask registration Solder mask Colors available include:  Green, Red, Blue, Black, White and Clear LEAD Hot air solder leveling SMOBC LEAD-FREE Hot Air leveling SMOBC (RoHS) Immersion Gold (ENIG) Immersion Silver

Immersion Tin   Organic ( OSP )   Soft Wire bondable Gold   Hard Gold   BURIED and BLIND Via’s   Carbon Ink   Electrical test 100 % fault verification (Clamshell,   flying probe and net-list)   Peelable solder mask (mask coverage on areas where no   reflow required)   Profiling, Routing, V-Score   Panel form standard for Automated Assembly.